The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

May. 28, 2015
Applicant:

The Trustees of the University of Pennsylvania, Philadelphia, PA (US);

Inventors:

Kevin Turner, Wayne, PA (US);

Helen Minsky, Philadelphia, PA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 65/48 (2006.01); B05D 3/00 (2006.01); G03F 7/038 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/26 (2006.01); B05D 1/02 (2006.01); G03F 7/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 65/48 (2013.01); B05D 1/02 (2013.01); B05D 3/007 (2013.01); G03F 7/0002 (2013.01); G03F 7/0385 (2013.01); G03F 7/162 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); B29L 2031/756 (2013.01);
Abstract

A structured composite surface includes a backing layer and a plurality of composite posts in contact with the backing layer, each composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus of at least 50 times greater than the outer shell. A method of transfer printing includes pressing a stamp including at least one composite post to a substrate, the at least one composite post having a core made of a first material and an outer shell made of a second material, the outer shell is in contact with and surrounding the core, the core has a Young's modulus at least 50 times greater than the outer shell, and retracting the stamp from the substrate by applying a shear load to the stamp.


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