The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Oct. 31, 2017
Applicant:

Shenmao Technology Inc., Taoyuan, TW;

Inventors:

Chang-Meng Wang, Taoyuan, TW;

Hsiang-Chuan Chen, Taoyuan, TW;

Ruei-Ying Sheng, Taoyuan, TW;

Chen-Yi Chen, Taoyuan, TW;

Albert T. Wu, Taoyuan, TW;

Chih-Hao Chen, Taoyuan, TW;

Yuan-Heng Zhong, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); B22F 3/10 (2006.01); B22F 3/12 (2006.01); C07C 55/02 (2006.01); C07C 55/22 (2006.01); C07D 307/62 (2006.01); C23C 24/10 (2006.01); B22F 7/04 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0059 (2013.01); B22F 3/1035 (2013.01); B22F 3/1233 (2013.01); C07C 55/02 (2013.01); C07C 55/22 (2013.01); C07D 307/62 (2013.01); C23C 24/106 (2013.01); B22F 2001/0066 (2013.01); B22F 2007/047 (2013.01); B22F 2301/10 (2013.01); B22F 2302/45 (2013.01); B22F 2304/058 (2013.01); B22F 2304/10 (2013.01);
Abstract

A liquid composition includes copper particles, an organic acid, and a solvent. The copper particle has a particle size of 0.5 μm˜30 μm which falls in a micron scale. The liquid composition performs reaction sintering by redox reactions taken place between the copper particles and an organic acid solution at a low temperature of 150° C. in order to produce a dense copper layer and improve the conventional micron-scale copper particles that requires a protective atmosphere for the high-temperature sintering before achieving the required densification. This liquid composition also prevents an excessive oxidation of the nano copper particles during the low-temperature sintering process and a failure of the dense sintering. Due to the agglomeration of nano copper particles, some areas have to be sintered first, so that the sintered products have a good uniformity of tissue and a low resistance below 0.04 ohm per square (Ω/□).


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