The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Dec. 06, 2013
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Scott A. Burton, Woodbury, MN (US);

Chin-Yee Ng, Oakdale, MN (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A61M 37/00 (2006.01);
U.S. Cl.
CPC ...
A61M 37/0015 (2013.01); A61M 2037/003 (2013.01); A61M 2037/0023 (2013.01); A61M 2209/088 (2013.01);
Abstract

Adhesive assemblies and microneedle injection apparatuses comprising same. The apparatus () can include a housing () having a base and an opening () formed in the base; and an applicator comprising a microneedle array (), the microneedle array comprising a first major surface () and microneedles (). The applicator can be movable between a first position, and a second position in which at least a portion of the microneedle array extends through the opening in the base. The apparatus can further include an adhesive assembly (), which can be adhered to the base of the housing. The adhesive assembly can include an extension () that extends at least partially into the area defined by the opening, such that when the applicator is in the second position, at least a portion of the first major surface of the microneedle array is in contact with the extension of the adhesive assembly.


Find Patent Forward Citations

Loading…