The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
May. 27, 2015
Applicant:
Conti Temic Microelectronic Gmbh, Nuremberg, DE;
Inventors:
Johannes Bock, Erlangen, DE;
Andreas Rebelein, Nuremberg, DE;
Andreas Schulze, Lauf A. D. Peg./OT Neunhof, DE;
Andreas Voegerl, Parsberg, DE;
Assignee:
Conti Temic microelectronic GmbH, Nuremberg, DE;
Primary Examiner:
Int. Cl.
CPC ...
B21C 37/00 (2006.01); H05K 3/46 (2006.01); C25D 3/12 (2006.01); C25D 3/30 (2006.01); C25D 3/48 (2006.01); C25D 3/56 (2006.01); C25D 3/60 (2006.01); C25D 3/62 (2006.01); C25D 7/06 (2006.01); H05K 3/24 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); C25D 3/12 (2013.01); C25D 3/30 (2013.01); C25D 3/48 (2013.01); C25D 3/562 (2013.01); C25D 3/60 (2013.01); C25D 3/62 (2013.01); C25D 7/0614 (2013.01); H05K 3/241 (2013.01); H05K 3/285 (2013.01); H05K 1/028 (2013.01); H05K 2201/032 (2013.01); H05K 2201/0355 (2013.01); H05K 2203/0723 (2013.01); Y10T 428/12431 (2015.01); Y10T 428/12438 (2015.01);
Abstract
A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.