The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Mar. 07, 2016
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Tomohiko Nagashima, Tokyo, JP;

Yoshihito Asao, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); G06F 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); G06F 1/188 (2013.01); H05K 1/0298 (2013.01); H05K 1/119 (2013.01); H05K 2201/062 (2013.01); H05K 2201/066 (2013.01);
Abstract

An electronic controlling apparatus includes a circuit board in which conductor layers and insulating layers are disposed alternately. In some embodiments, thicknesses of an upper portion outer conductor layer that is disposed on a first surface of the circuit board and a lower portion outer conductor layer that is disposed on a second surface of the circuit board are identical and have greatest thickness among the conductor layers, or thicknesses of a first outermost position inner conductor layer and a second outermost position inner conductor layer that are positioned at two end portions inside the circuit board are identical and have greatest thickness among the conductor layers, and the conductor layers are disposed symmetrically so as to have a central plane in a thickness direction of the circuit board as a plane of symmetry. In some embodiments, thicknesses and arrangements of conductor layers are not symmetrical in the thickness direction of the circuit board.


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