The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

May. 24, 2018
Applicant:

Knowles Electronics, Llc, Itasca, IL (US);

Inventors:

Tony K. Lim, Naperville, IL (US);

John Szczech, Itasca, IL (US);

Joshua Watson, Itasca, IL (US);

Assignee:

Knowles Electronics, LLC, Itasca, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 1/04 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); H04R 1/04 (2013.01); H04R 19/005 (2013.01); H04R 2201/003 (2013.01);
Abstract

A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.


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