The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Sep. 14, 2017
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); H01L 21/768 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/105 (2013.01); B81B 7/0064 (2013.01); B81C 1/00301 (2013.01); H01L 21/76898 (2013.01); H03H 9/059 (2013.01); H03H 9/1014 (2013.01); H03H 9/1092 (2013.01); B81B 2207/096 (2013.01); B81C 2203/0109 (2013.01);
Abstract
A filter includes a multilayer structure comprising films and forming bulk acoustic wave resonators, a cap accommodating the bulk acoustic wave resonators and bonded to the multilayer structure, a bonding agent disposed in a bonded area between the multilayer structure and the cap and comprising a bonding layer, and a shielding layer disposed on an inner surface of the cap and comprising a same material as at least a portion of the bonding layer.