The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Aug. 01, 2018
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Jock T. Bovington, La Mesa, CA (US);

Ashley J. Maker, Pleasanton, CA (US);

Kumar Satya Harinadh Potluri, Milpitas, CA (US);

Assignee:

Cisco Technology, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); G02B 6/42 (2006.01); G02B 6/12 (2006.01); H01S 5/02 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02236 (2013.01); G02B 6/12019 (2013.01); G02B 6/4296 (2013.01); H01S 5/02284 (2013.01); H01S 5/021 (2013.01); H01S 5/0207 (2013.01);
Abstract

A submount assembly comprises a first substrate having a first surface and an opposing second surface, wherein a plurality of first grooves are formed into the first substrate from the first surface. Each first groove is dimensioned to receive a portion of a respective optical fiber of a plurality of optical fibers, and to arrange the optical fiber with a predetermined first height relative to the first surface. The submount assembly further comprises a plurality of first conductive traces on a side of the first substrate corresponding to the first surface, and a semiconductor laser contacted with the first conductive traces. The semiconductor laser has a predetermined second height relative to the first surface. The submount assembly further comprises a plurality of second conductive traces at the second surface and a plurality of first vias extending through the first substrate from the first conductive traces to the second conductive traces.


Find Patent Forward Citations

Loading…