The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jun. 13, 2017
Applicant:

Phoenix Contact E-mobility Gmbh, Schieder-Schwalenberg, DE;

Inventors:

Ralf Feldner, Detmold, DE;

Carsten Garth, Lemgo, DE;

Tanja Gebhardt, Schlangen, DE;

Assignee:

PHOENIX CONTACT E-MOBILITY GMBH, Schieder-Schwalenberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/71 (2011.01); H01R 27/02 (2006.01); H01R 13/66 (2006.01); H01R 13/502 (2006.01); H05K 1/11 (2006.01); B60L 53/16 (2019.01); H01R 13/24 (2006.01);
U.S. Cl.
CPC ...
H01R 12/714 (2013.01); H01R 13/502 (2013.01); H01R 13/6683 (2013.01); H01R 27/02 (2013.01); H05K 1/119 (2013.01); B60L 53/16 (2019.02); B60Y 2200/91 (2013.01); B60Y 2300/91 (2013.01); H01R 12/716 (2013.01); H01R 13/2421 (2013.01); H01R 13/2428 (2013.01); H01R 2201/20 (2013.01); H01R 2201/26 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10265 (2013.01);
Abstract

Disclosed is an electrical connection apparatus for coupling to a corresponding connecting device and for transmitting electrical energy. The electrical connection apparatus includes at least one power contact arranged in a housing of the apparatus and connected to the housing, and at least one temperature sensor for determining a temperature of the power contact. The apparatus further includes a printed circuit board arranged in the housing of the electrical connection apparatus between the power contact and a retaining section of the housing, with the printed circuit board being clamped between the power contact and the retaining section by means of a spring-force apparatus arranged between the power contact and the retaining section. The printed circuit board is thermally coupled to the power contact directly or by means of the spring-force apparatus. The at least one temperature sensor is arranged on the printed circuit board.


Find Patent Forward Citations

Loading…