The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Jan. 18, 2017
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventor:
Daisuke Nagano, Matsumoto, JP;
Assignee:
SEIKO EPSON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/1391 (2010.01); H01M 10/052 (2010.01); H01M 10/0562 (2010.01); H01M 10/0585 (2010.01); H01M 4/62 (2006.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/1391 (2013.01); H01M 4/622 (2013.01); H01M 10/052 (2013.01); H01M 10/0562 (2013.01); H01M 10/0585 (2013.01); H01M 2004/021 (2013.01); H01M 2004/028 (2013.01);
Abstract
A method for producing an electrode assembly which includes a first step of forming a molded body that contains an active material, a second step of dipping the molded body in a melt of a solid electrolyte in a first atmosphere, thereby impregnating the melt into voids inside the molded body; and a third step of cooling the molded body impregnated with the melt by moving the molded body to a second atmosphere whose temperature is lower than that of the first atmosphere, thereby combining the molded body with the solid electrolyte.