The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Feb. 01, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Masahiro Hayashi, Osaka, JP;

Tetsuya Kamada, Kagoshima, JP;

Takashi Kuwaharada, Kagoshima, JP;

Kiyomi Hagihara, Osaka, JP;

Toshikazu Shimokatano, Tokyo, JP;

Shigeo Hayashi, Kagoshima, JP;

Hiroki Shirozono, Kagoshima, JP;

Hideaki Usukubo, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); H01L 33/38 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/85 (2013.01); H01L 33/387 (2013.01); H01L 33/64 (2013.01); H01L 33/642 (2013.01); H01L 33/644 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 33/486 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48237 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81203 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1207 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01);
Abstract

A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.


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