The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Sep. 22, 2015
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Gyu Hyeong Bak, Seoul, KR;

Bong Kul Min, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01); H01L 33/48 (2010.01); H01L 33/08 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/0075 (2013.01); H01L 33/405 (2013.01); H01L 33/08 (2013.01); H01L 33/486 (2013.01); H01L 33/505 (2013.01);
Abstract

A light-emitting device package according to an embodiment provides a light-emitting device including a light-emitting structure having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a package body; first and second lead frames disposed in the package body and disposed to be electrically isolated from each other; a first solder portion of a solid state disposed between the first lead frame and the first conductive semiconductor layer, the first solder portion having a uniform area and an even thickness; and a second solder portion of a solid state disposed between the second lead frame and the second conductive semiconductor layer, the second solder portion having a uniform area and an even thickness.


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