The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jul. 21, 2009
Applicants:

Michael S. Leung, Goleta, CA (US);

Eric J. Tarsa, Goleta, CA (US);

James Ibbetson, Santa Barbara, CA (US);

Inventors:

Michael S. Leung, Goleta, CA (US);

Eric J. Tarsa, Goleta, CA (US);

James Ibbetson, Santa Barbara, CA (US);

Assignee:

Cree, Inc., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/50 (2010.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 33/504 (2013.01); H01L 21/565 (2013.01); H01L 24/96 (2013.01); H01L 27/15 (2013.01); H01L 33/50 (2013.01); H01L 2224/2518 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2933/0041 (2013.01);
Abstract

A light emitting diode (LED) is disclosed comprising a plurality of semiconductor layers with a first contact on the bottom surface of the semiconductor layers and a second contact on the top surface of the semiconductor layer. A coating is included that comprises a cured binder and a conversion material that at least partially covers the semiconductor layers, wherein the second contact extends through the coating and is exposed on the same plane as the top surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light. In other embodiments first and second contacts are accessible from one side of the LED. A coating is included that comprises a cured binder and a conversion material. The coating at least partially covers the semiconductor layers, with the first and second contacts extending through the coating and exposed on the same plane as a surface of the coating. An electrical signal applied to the first and second contacts is conducted through the coating to the semiconductor layers causing the LED to emit light.


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