The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Feb. 22, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andreas Meiser, Sauerlach, DE;

Ralf Rudolf, Dresden, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 21/74 (2006.01); H01L 21/761 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0623 (2013.01); H01L 21/26513 (2013.01); H01L 21/743 (2013.01); H01L 21/761 (2013.01); H01L 29/1087 (2013.01);
Abstract

A semiconductor device includes a semiconductor substrate of a first conductivity type. A first semiconductor layer of a second conductivity type is on the semiconductor substrate. A buried semiconductor layer of the second conductivity type is on the first semiconductor layer. A second semiconductor layer of the second conductivity type is on the buried semiconductor layer. A trench extends through each of the second semiconductor layer, the buried semiconductor layer, and the first semiconductor layer, and into the semiconductor substrate. An insulating structure lines walls of the trench. A conductive filling in the trench is electrically coupled to the semiconductor substrate at a bottom of the trench.


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