The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Mar. 27, 2017
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

John A. Rogers, Champaign, IL (US);

Ralph Nuzzo, Champaign, IL (US);

Hoon-sik Kim, Champaign, IL (US);

Eric Brueckner, Champaign, IL (US);

Sang Il Park, Savoy, IL (US);

Rak Hwan Kim, Champaign, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/32 (2010.01); H01L 25/075 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/00 (2006.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 21/6835 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 25/50 (2013.01); H01L 33/0079 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/54 (2013.01); H01L 33/32 (2013.01); H01L 33/62 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/8312 (2013.01); H01L 2224/83868 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/83874 (2013.01); H01L 2224/95085 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/06 (2013.01); H01L 2924/12033 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H01L 2924/2064 (2013.01); H01L 2924/20641 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0041 (2013.01); Y10S 438/977 (2013.01);
Abstract

Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are useful for assembling electronic devices where one or more device components are embedded in a polymer which is patterned during the embedding process with trenches for electrical interconnects between device components. Some methods described herein are useful for assembling electronic devices by printing methods, such as by dry transfer contact printing methods. Also described herein are GaN light emitting diodes and methods for making and arranging GaN light emitting diodes, for example for display or lighting systems.


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