The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Feb. 27, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric V. Kline, Rochester, MN (US);

Arvind K. Sinha, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/11 (2006.01); H05K 13/04 (2006.01); B23K 1/018 (2006.01); B23K 1/00 (2006.01); H05K 3/22 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/17 (2013.01); B23K 1/0016 (2013.01); B23K 1/018 (2013.01); H01L 24/98 (2013.01); H05K 1/11 (2013.01); H05K 3/225 (2013.01); H05K 13/0486 (2013.01); B23K 2101/42 (2018.08); H01L 2224/16227 (2013.01); H01L 2224/1713 (2013.01); H05K 2201/0308 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/081 (2013.01); H05K 2203/1115 (2013.01); H05K 2203/176 (2013.01);
Abstract

Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.


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