The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Aug. 31, 2017
Applicant:
Toshiba Memory Corporation, Tokyo, JP;
Inventor:
Yuusuke Takano, Yokkaichi Mie, JP;
Assignee:
TOSHIBA MEMORY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/3205 (2006.01); B41M 5/26 (2006.01); H01L 21/268 (2006.01); H01L 21/56 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); B41M 5/262 (2013.01); H01L 21/268 (2013.01); H01L 21/32051 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/552 (2013.01); H01L 21/02186 (2013.01); H01L 23/3121 (2013.01); H01L 2223/54433 (2013.01);
Abstract
A semiconductor package includes a substrate, a semiconductor element disposed on the substrate, an encapsulating layer covering side surfaces and a top surface of the semiconductor element, an electromagnetic shield layer covering side surfaces of the substrate and side surfaces and a top surface of the encapsulating layer, and a titanium oxide layer formed above a top surface of the electromagnetic shield layer, and including a first portion containing divalent titanium oxide and a second portion containing tetravalent titanium oxide.