The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Apr. 12, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Yasunari Hino, Tokyo, JP;
Yuji Sato, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/433 (2006.01); H01L 23/00 (2006.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H01L 23/4334 (2013.01); H01L 24/48 (2013.01); H02M 7/5387 (2013.01); H01L 24/45 (2013.01);
Abstract
A semiconductor module includes: a semiconductor device having an upper surface electrode; a conductor plate joined to the upper surface electrode via a bonding member; and a wire bonded to the conductor plate, wherein the wire is a metal thread or a ribbon bond, and the bonding member is a porous sintered metal material impregnated with resin.