The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jun. 23, 2016
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Satoshi Oku, Osaka, JP;

Makoto Kutsumizu, Osaka, JP;

Yasushi Nishikawa, Osaka, JP;

Assignee:

KANEKA CORPORATION, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 21/48 (2006.01); H05K 7/20 (2006.01); F28F 3/00 (2006.01); C01B 32/20 (2017.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); C01B 32/20 (2017.08); F28F 3/00 (2013.01); H01L 21/4878 (2013.01); H01L 21/4882 (2013.01); H01L 23/36 (2013.01); H01L 23/3677 (2013.01); H05K 7/20 (2013.01); Y02P 20/124 (2015.11);
Abstract

Provided are (i) a heat transport structure which is excellent in heat transfer efficiency and (ii) a method of producing such a heat transport structure. The heat transport structure in accordance with an embodiment of the present invention includes: a first thermally conductive material in which through holes are formed; and second thermally conductive materials which are fitted in the respective through holes in a perpendicular direction which is a direction perpendicular to a surface direction, a thermal conductivity which the first thermally conductive material exhibits in the surface direction being higher than a thermal conductivity which the first thermally conductive material exhibits in the perpendicular direction, each of the second thermally conductive materials being held by an inner surface of a corresponding one of the through holes and having fitting strength of not less than 0.5 N/mm per unit circumference of the corresponding one of the through holes.


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