The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Feb. 10, 2017
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Hsin-Hua Hu, Los Altos, CA (US);

Jaein Choi, San Jose, CA (US);

James E. Pedder, Cupertino, CA (US);

Ion Bita, Santa Clara, CA (US);

Hairong Tang, San Jose, CA (US);

Chin Wei Hsu, Hsinchu, TW;

Sandeep Chalasani, San Jose, CA (US);

Chih-Lei Chen, Taichung, TW;

Sunggu Kang, San Jose, CA (US);

Shinya Ono, Cupertino, CA (US);

Jung Yen Huang, Zhubei, TW;

Lun Tsai, Zhubei, TW;

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3192 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/95 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 2224/10145 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/11464 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/81815 (2013.01);
Abstract

Micro LED and microdriver chip integration schemes are described. In an embodiment a microdriver chip includes a plurality of trenches formed in a bottom surface of the microdriver chip, with each trench surrounding a conductive stud extending below a bottom surface of the microdriver chip body. Integration schemes are additionally described for providing electrical connection to conductive terminal contacts and micro LEDs bonded to a display substrate and adjacent to a microdriver chip.


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