The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Jul. 17, 2018
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;
Takuya Kadoguchi, Toyota, JP;
Yuuji Hanaki, Nagoya, JP;
Atsuko Yamanaka, Toyota, JP;
Shou Funano, Toyota, JP;
Satoshi Takahagi, Nagakute, JP;
Shingo Iwasaki, Nisshin, JP;
TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, JP;
Abstract
A method of manufacturing a semiconductor device that includes a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, in which each of the pair of metal plates is exposed at corresponding one of both surfaces of the resin package is disclosed. The method may include preparing an assembly in which the semiconductor element is connected to the pair of metal plates; setting the assembly in a cavity of a mold, wherein one metal plate is in contact with a bottom surface of the cavity and a space is provided above the other metal plate; forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled.