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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10546681 B1

PDFFull Text
Date of Patent:
Jan. 28, 2020

Filed:

May. 15, 2019

Electronic component having lead part including regions having different thicknesses and method of manufacturing the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Dong Jin Jeong, Suwon-si, KR;

Kyung Seop Lee, Suwon-si, KR;

Yong Un Choi, Suwon-si, KR;

Kyung Min Son, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:

Morgan, Lewis & Bockius LLP

Primary Examiner:

Elvin G Enad

Assistant Examiner:

Malcolm Barnes

Int. Cl.
CPC ...
H01F 27/29 (2006.01); H01F 41/10 (2006.01); H01F 27/255 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/255 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/292 (2013.01); H01F 41/046 (2013.01); H01F 2017/048 (2013.01);
Abstract

An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.

Find Patent Forward Citations

Jeong, Dong. (2020). Electronic component having lead part including regions having different thicknesses and method of manufacturing the same (U.S. Patent No. 10546681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10546681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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