The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Oct. 27, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Krishna T. Malladi, San Jose, CA (US);
Hongzhong Zheng, Los Gatos, CA (US);
Robert Brennan, Santa Clara, CA (US);
Hyungseuk Kim, Hwaseong-si, KR;
Jinhyun Kim, Hwaseong-si, KR;
Abstract
Inventive aspects include An HBM+ system, comprising a host including at least one of a CPU, a GPU, an ASIC, or an FPGA; and an HBM+ stack including a plurality of HBM modules arranged one atop another, and a logic die disposed beneath the plurality of HBM modules. The logic die is configured to offload processing operations from the host. A system architecture is disclosed that provides specific compute capabilities in the logic die of high bandwidth memory along with the supporting hardware and software architectures, logic die microarchitecture, and memory interface signaling options. Various new methods are provided for using in-memory processing abilities of the logic die beneath an HBM memory stack. In addition, various new signaling protocols are disclosed to use an HBM interface. The logic die microarchitecture and supporting system framework are also described.