The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Sep. 20, 2016
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); G03F 7/038 (2006.01); C08G 69/02 (2006.01); G03F 7/40 (2006.01); G03F 7/20 (2006.01); C08G 69/40 (2006.01); G03F 7/16 (2006.01); G03F 7/26 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08G 69/02 (2013.01); C08G 69/40 (2013.01); G03F 7/16 (2013.01); G03F 7/161 (2013.01); G03F 7/168 (2013.01); G03F 7/20 (2013.01); G03F 7/26 (2013.01); G03F 7/40 (2013.01); H01L 23/562 (2013.01); H01L 24/02 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/024 (2013.01); H01L 2224/02331 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03515 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/13026 (2013.01); H01L 2924/0695 (2013.01); H01L 2924/3511 (2013.01);
Abstract
Provided is a cured film of high elongation, low stress, and high adhesion to metal copper. The cured film is formed by curing a photosensitive resin composition, wherein the photosensitive resin comprises a polyhydroxyamide, and wherein the rate of ring-closure of the polyhydroxyamide in the cured film is not more than 10%.