The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

May. 23, 2017
Applicant:

Uacj Corporation, Chiyoda-ku, Tokyo, JP;

Inventors:

Yuya Sawa, Tokyo, JP;

Minoru Hayashi, Tokyo, JP;

Assignee:

UACJ CORPORATION, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/05 (2006.01); C22C 21/08 (2006.01); C22F 1/057 (2006.01); C22C 21/14 (2006.01); C22C 21/16 (2006.01); C22F 1/047 (2006.01); C22F 1/04 (2006.01); C22C 21/00 (2006.01); C22C 21/02 (2006.01);
U.S. Cl.
CPC ...
C22F 1/057 (2013.01); C22C 21/08 (2013.01); C22C 21/14 (2013.01); C22C 21/16 (2013.01); C22F 1/047 (2013.01);
Abstract

The present invention relates to a high-strength aluminum alloy thick plate composed of an aluminum alloy including a prescribed quantity of Si, Mg, Ti, Fe, and the balance Al. The thick plate has a material structure in which an area ratio of MgSi having circle equivalent diameters of 3 μm or more in a plate thickness central portion is 0.45% or less; and an area ratio of MgSi having circle equivalent diameters of 3 μm or more in a region of 20 mm±1.5 mm from a plate surface in a plate thickness direction is 1.2 times or more and 3.0 times or less the area ratio of MgSi having circle equivalent diameters of 3 μm or more in the plate thickness central portion. The aluminum alloy thick plate has sufficient strength and good uniformity of strength in the plate thickness direction, and can be manufactured by cooling it after a solution treatment, so that suitable temperature difference occurs between a plate thickness central portion and a surface, and then performing a quenching treatment.


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