The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Mar. 08, 2018
Applicant:
Kaneka Corporation, Osaka, JP;
Inventors:
Toshiaki Ezaki, Osaka, JP;
Kazunori Saegusa, Osaka, JP;
Assignee:
KANEKA CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); F21V 29/503 (2015.01); F21V 29/87 (2015.01); F21V 29/76 (2015.01); C08K 3/04 (2006.01); F21S 45/47 (2018.01); C08L 67/02 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/042 (2017.05); C08L 67/02 (2013.01); F21S 45/47 (2018.01); F21V 29/503 (2015.01); F21V 29/763 (2015.01); F21V 29/87 (2015.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); F21Y 2115/10 (2016.08);
Abstract
Provided is a thermally conductive resin composition having a specific gravity of 1.4-2.0 and an In-Plane thermal conductivity of 1 W/(m·K) or higher, and containing at least (A) 30-90% by mass of a thermoplastic resin, (B) 9-69% by mass of an inorganic filler having a thermal conductivity of 1 W/(m·K) or higher, and (C) 0.05-10% by mass of a crystallization accelerator.