The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Dec. 16, 2014
Applicants:
Nitto Denko Corporation, Ibaraki-shi, Osaka, JP;
Nitto Shinko Corporation, Sakai-shi, Fukui, JP;
Inventors:
Kenichi Fujikawa, Osaka, JP;
Yoshiharu Hatakeyama, Osaka, JP;
Miho Yamaguchi, Osaka, JP;
Yuji Yamagishi, Fukui, JP;
Akihiro Oohashi, Fukui, JP;
Assignees:
NITTO DENKO CORPORATION, Osaka, JP;
NITTO SHINKO CORPORATION, Fukui, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08K 3/38 (2006.01); C08K 3/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/36 (2006.01); C08J 3/20 (2006.01); C08J 5/18 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2201/001 (2013.01);
Abstract
The present invention provides a thermal conductive polymer composition with low probability for mixing of an air bubble in a thermal conductive molded article, which is a thermal conductive polymer composition including thermal conductive inorganic particles having a specific particle size distribution and an electrically insulating polymer.