The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Sep. 12, 2017
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Marcus Heemann, Neuss, DE;

Sebastian Kostyra, Monheim, DE;

Eckhard Puerkner, Duesseldorf, DE;

Gerald Petry, Hueckelhoven, DE;

Riju Davis, Schwabmuenchen, DE;

Assignee:

Henkel AG & Co. KGaA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 23/12 (2006.01); B29C 48/04 (2019.01); B29B 9/12 (2006.01); C08L 23/08 (2006.01); B29B 9/16 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C08L 23/12 (2013.01); B29B 9/12 (2013.01); B29C 48/04 (2019.02); C08L 23/0807 (2013.01); B29B 2009/163 (2013.01); B29K 2105/0097 (2013.01); C08J 2423/08 (2013.01); C08L 2203/16 (2013.01); C08L 2314/06 (2013.01);
Abstract

The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ≤1000 and ≥300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.


Find Patent Forward Citations

Loading…