The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jan. 19, 2018
Applicant:

Infineon Technologies Dresden Gmbh, Dresden, DE;

Inventors:

Thoralf Kautzsch, Dresden, DE;

Heiko Froehlich, Radebeul, DE;

Alessia Scire, Dresden, DE;

Maik Stegemann, Pesterwitz, DE;

Bernhard Winkler, Regensburg, DE;

Andre Roeth, Dresden, DE;

Steffen Bieselt, Wehlen, DE;

Mirko Vogt, Dresden, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/0015 (2013.01); B81B 3/0078 (2013.01); B81B 2201/0235 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0163 (2013.01);
Abstract

The present disclosure relates to an integrated semiconductor device, comprising a semiconductor substrate; a cavity formed into the semiconductor substrate; a sensor portion of the semiconductor substrate deflectably suspended in the cavity at one side of the cavity via a suspension portion of the semiconductor substrate interconnecting the semiconductor substrate and the sensor portion thereof, wherein an extension of the suspension portion along the side of the cavity is smaller than an extension of said side of the cavity.


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