The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Apr. 05, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Hsiu-Pen Lin, Taipei, TW;

Kun-Cheng Tsai, Taipei, TW;

Chienchih Chiu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/06 (2006.01); B32B 15/08 (2006.01); B29C 45/00 (2006.01); B29C 45/14 (2006.01); B29C 45/16 (2006.01); G06F 1/16 (2006.01); H05K 5/02 (2006.01);
U.S. Cl.
CPC ...
B32B 3/06 (2013.01); B29C 45/0001 (2013.01); B29C 45/14639 (2013.01); B29C 45/16 (2013.01); B32B 15/08 (2013.01); G06F 1/1601 (2013.01); G06F 1/1616 (2013.01); H05K 5/02 (2013.01);
Abstract

In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.


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