The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Oct. 28, 2015
The University of Melbourne, Melbourne, Victoria, AU;
National Ict Australia Limited, Eveleigh, New South Wales, AU;
Steven Prawer, Melbourne, AU;
Kumaravelu Ganesan, Melbourne, AU;
David Garrett, Melbourne, AU;
Nicholas Apollo, Melbourne, AU;
Alastair Stacey, Melbourne, AU;
Mathilde Escudie, Melbourne, AU;
Hamish Meffin, Eveleigh, AU;
Samantha Lichter, Eveleigh, AU;
The University of Melbourne, Melbourne, Victoria, AU;
National ICT Australia Limtied, Eveleigh, New South Wales, AU;
Abstract
The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.