The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Jul. 19, 2017
Applicant:

Omron Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Hiroyuki Mori, Ono, JP;

Mayuko Kishimoto, Kyoto, JP;

Shimpei Fujii, Souraku-gun, JP;

Katsuki Nakajima, Kyoto, JP;

Assignee:

OMRON Corporation, Kyoto-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 13/08 (2006.01); G01N 21/956 (2006.01); G06T 7/00 (2017.01); G06T 7/73 (2017.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); G05B 19/418 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); B23K 101/42 (2006.01); G01R 31/04 (2006.01);
U.S. Cl.
CPC ...
H05K 13/08 (2013.01); B23K 1/0016 (2013.01); B23K 3/08 (2013.01); G01N 21/95684 (2013.01); G05B 19/41875 (2013.01); G06T 7/001 (2013.01); G06T 7/74 (2017.01); H05K 1/0269 (2013.01); H05K 3/341 (2013.01); H05K 13/0817 (2018.08); B23K 2101/42 (2018.08); G01R 31/048 (2013.01); G06T 2207/30141 (2013.01); H05K 2203/163 (2013.01);
Abstract

An inspection apparatus includes an imaging unit that captures an image of a board having a land on which a solder piece has been printed, an image of the board having a component mounted on the solder piece, or an image of the board having the component soldered to the land, a land determination unit that determines a position of an element on the board other than the land from the image of the board captured by the imaging unit, and determines a position of the land in the image based on the determined position of the element, and an inspection unit that inspects the solder piece or component on the land using the position of the land determined by the land determination unit as a reference.


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