The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Mar. 27, 2018
Applicant:
Samsung Electronics Co., Ltd, Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 9/00 (2006.01); H05K 3/30 (2006.01); H05K 1/18 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 3/34 (2006.01); B32B 15/01 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 9/04 (2006.01); C22C 38/40 (2006.01); C22C 9/06 (2006.01); H05K 1/02 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0049 (2013.01); B23K 35/0238 (2013.01); B23K 35/262 (2013.01); B32B 15/013 (2013.01); B32B 15/018 (2013.01); C22C 9/04 (2013.01); C22C 9/06 (2013.01); C22C 38/40 (2013.01); H05K 1/0306 (2013.01); H05K 1/053 (2013.01); H05K 1/181 (2013.01); H05K 3/303 (2013.01); H05K 3/341 (2013.01); H05K 9/0028 (2013.01); B23K 2101/42 (2018.08); H05K 1/0216 (2013.01); H05K 2201/10318 (2013.01); H05K 2201/10333 (2013.01); H05K 2201/10371 (2013.01); Y02P 70/613 (2015.11);
Abstract
According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.