The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Jul. 09, 2018
Applicant:

MD Elektronik Gmbh, Waldkraiburg, DE;

Inventors:

Martin Huber, Obing, DE;

Robert Hofmann, Truchtlaching, DE;

Assignee:

MD ELEKTRONIK GMBH, Waldkraiburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/53 (2011.01); H01R 4/02 (2006.01); H01R 43/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01); H01R 12/70 (2011.01); H01R 24/50 (2011.01);
U.S. Cl.
CPC ...
H01R 12/53 (2013.01); H01R 4/02 (2013.01); H01R 43/0256 (2013.01); H05K 1/183 (2013.01); H05K 3/0044 (2013.01); H05K 3/34 (2013.01); H01R 12/7023 (2013.01); H01R 24/50 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10393 (2013.01); H05K 2203/0475 (2013.01);
Abstract

An interconnection includes a cable assembly and a board assembly. The cable assembly includes a cable having an inner conductor. The board assembly comprises an intermediate layer disposed between first and second outer layers, a recess disposed between the first and second outer layers so as to form a cable-receiving space at a first side edge, and a first inner-conductor contact opening extending through at least one of the first and second outer layers and opening into the cable-receiving space. The inner conductor is inserted at the first side edge into the cable-receiving space and is disposed at an offset in a longitudinal direction relative to the first inner-conductor contact opening. The inner conductor is electrically conductively soldered via a first soldered inner-conductor connection to a first inner-conductor connection region of the first and/or second outer layers, at least in a region of the first inner-conductor contact opening.


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