The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
May. 23, 2018
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Chikao Ikenaga, Tokyo, JP;
Yo Shimazaki, Tokyo, JP;
Kentarou Seki, Tokyo, JP;
Hiroki Furushou, Tokyo, JP;
Chiaki Hatsuta, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/56 (2006.01); C23C 14/04 (2006.01); C25D 1/10 (2006.01); C23C 16/04 (2006.01); C25D 5/02 (2006.01); H01L 51/50 (2006.01); C25D 1/08 (2006.01); H01L 51/00 (2006.01); C23C 18/16 (2006.01); C23C 14/24 (2006.01); C23F 1/02 (2006.01); C23C 18/32 (2006.01); B23K 26/073 (2006.01); C22C 38/10 (2006.01); C25D 5/12 (2006.01); C25D 3/16 (2006.01);
U.S. Cl.
CPC ...
H01L 51/56 (2013.01); C23C 14/042 (2013.01); C23C 14/24 (2013.01); C23C 16/042 (2013.01); C23C 18/1605 (2013.01); C23C 18/1651 (2013.01); C23C 18/1653 (2013.01); C23C 18/1657 (2013.01); C23C 18/32 (2013.01); C23F 1/02 (2013.01); C25D 1/08 (2013.01); C25D 1/10 (2013.01); C25D 5/022 (2013.01); H01L 51/0011 (2013.01); H01L 51/5012 (2013.01); B23K 26/073 (2013.01); C22C 38/105 (2013.01); C25D 3/16 (2013.01); C25D 5/12 (2013.01);
Abstract
A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisfies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.