The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Apr. 11, 2018
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Jun Woo Myung, Suwon-si, KR;
Akihisa Kuroyanagi, Suwon-si, KR;
Yeong A Kim, Suwon-si, KR;
Eun Sil Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3171 (2013.01); H01L 23/291 (2013.01); H01L 23/3135 (2013.01); H01L 24/48 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/451 (2013.01); H01L 2924/182 (2013.01); H01L 2924/183 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.