The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Aug. 03, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Christopher James Kapusta, Delanson, NY (US);

Raymond Albert Fillion, Niskayuna, NY (US);

Risto Ilkka Sakari Tuominen, Tokyo, JP;

Kaustubh Ravindra Nagarkar, Clifton Park, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/52 (2006.01); H01L 23/28 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/485 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/4889 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 23/28 (2013.01); H01L 23/3114 (2013.01);
Abstract

An electronics package includes an insulating substrate, an electrical component having a back surface coupled to a first surface of the insulating substrate, and an insulating structure surrounding at least a portion of a perimeter of the electrical component. A first wiring layer extends from the first surface of the insulating substrate and over a sloped side surface of the insulating structure to electrically couple with at least one contact pad on an active surface of the electrical component. A second wiring layer is formed on a second surface of the insulating substrate and extends through at least one via therein to electrically couple with the first wiring layer.


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