The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Dec. 07, 2016
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventor:
Bradley Paul Barber, Acton, MA (US);
Assignee:
SKYWORKS SOLUTIONS, INC., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01Q 1/48 (2006.01); H01Q 1/38 (2006.01); H05K 1/18 (2006.01); H01L 23/66 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4803 (2013.01); H01L 23/10 (2013.01); H01L 23/66 (2013.01); H01Q 1/38 (2013.01); H01Q 1/48 (2013.01); H05K 1/181 (2013.01); H01L 2223/6644 (2013.01); H05K 2201/10098 (2013.01);
Abstract
A bonding element includes a first transient liquid phase (TLP) bonding element including a first material and a second material, the first material having a higher melting point than the second material, a ratio of a quantity of the first material and the second material in the first TLP bonding element having a first value and a second TLP bonding element including the first material and the second material, a ratio of a quantity of the first material and the second material in the second TLP bonding element having a second value different from the first value.