The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Aug. 04, 2016
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventor:

Kenichi Yokouchi, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/26 (2006.01); F27B 5/14 (2006.01); F27B 5/18 (2006.01); F27D 11/02 (2006.01); H01L 21/324 (2006.01); F27B 17/00 (2006.01); F27D 5/00 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/02 (2006.01); F27D 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/324 (2013.01); F27B 5/18 (2013.01); F27B 17/0025 (2013.01); F27D 5/0037 (2013.01); H01L 21/02425 (2013.01); H01L 21/67103 (2013.01); H01L 21/67115 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01); F27D 11/02 (2013.01); F27D 13/00 (2013.01);
Abstract

Flash lamps connected to short-pulse circuits and flash lamps connected to long-pulse circuits are alternately arranged in a line. The duration of light emission from the flash lamps connected to the long-pulse circuits is longer than the duration of light emission from the flash lamps connected to the short-pulse circuits. A superimposing of a flash of light with a high peak intensity from the flash lamps that emit light for a short time and a flash of light with a gentle peak from the flash lamps that emit light for a long time can increase the temperature of even a deep portion of a substrate to an activation temperature or more without heating a shallow portion near the substrate surface more than necessary. This achieves the activation of deep junctions without causing substrate warpage or cracking.


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