The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Jun. 01, 2015
Applicant:
Moda-innochips Co., Ltd., Ansan-Si, Gyeonggi-Do, KR;
Inventors:
In Kil Park, Seongnam-Si, KR;
Tae Hyung Noh, Siheung-Si, KR;
Gyeong Tae Kim, Ansan-Si, KR;
Seung Hun Cho, Siheung-Si, KR;
Jun Ho Jung, Siheung-Si, KR;
Ki Joung Nam, Siheung-Si, KR;
Jung Gyu Lee, Seoul, KR;
Assignee:
MODA-INNOCHIPS CO., LTD., , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/22 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01); H01F 27/255 (2006.01); H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 27/24 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01);
U.S. Cl.
CPC ...
H01F 27/22 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 27/323 (2013.01); H01F 27/324 (2013.01); H01F 41/041 (2013.01); H01F 41/122 (2013.01); H01F 2017/048 (2013.01); H01F 2027/2809 (2013.01);
Abstract
The present disclosure provides a power inductor, which includes a body, at least one substrate provided inside the body, at least one coil pattern provided on at least one surface of the substrate, and an insulation layer formed between the coil pattern and the body, wherein the insulation layer is formed of parylene.