The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Sep. 23, 2016
Applicant:

The Board of Trustees of the University of Illinois, Urbana, IL (US);

Inventors:

Anthony Coppola, Urbana, IL (US);

Scott R. White, Champaign, IL (US);

Nancy R. Sottos, Champaign, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
F25B 19/00 (2006.01); F25D 7/00 (2006.01); B32B 18/00 (2006.01); B32B 27/08 (2006.01); B32B 15/00 (2006.01); B32B 7/12 (2006.01); B32B 9/00 (2006.01); B32B 9/04 (2006.01); B32B 5/26 (2006.01); B32B 27/12 (2006.01); B32B 15/01 (2006.01); B32B 15/18 (2006.01); B32B 15/14 (2006.01); B32B 5/02 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/06 (2006.01); B22F 7/00 (2006.01);
U.S. Cl.
CPC ...
F25B 19/00 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 9/005 (2013.01); B32B 9/041 (2013.01); B32B 9/045 (2013.01); B32B 9/047 (2013.01); B32B 15/00 (2013.01); B32B 15/01 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 15/18 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); F25D 7/00 (2013.01); B22F 7/004 (2013.01); B32B 2250/02 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/732 (2013.01);
Abstract

Autonomic cooling of a substrate is achieved using a porous thermal protective layer to provide evaporative cooling combined with capillary pumping. The porous thermal protective layer is manufactured onto the substrate. A vascular network is integrated between the substrate and the protective layer. Applied heat causes fluid contained in the protective layer to evaporate, removing heat. The fluid lost to evaporation is replaced by capillary pressure, pulling fluid from a fluid-containing reservoir through the vascular network. Cooling occurs as liquid evaporates from the protective layer.


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