The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Jun. 25, 2015
Dipsol Chemicals Co., Ltd., Tokyo, JP;
Hitoshi Sakurai, Chiba, JP;
Kazunori Ono, Tokyo, JP;
Akira Hashimoto, Chiba, JP;
Satoshi Yuasa, Chiba, JP;
DIPSOL CHEMICALS CO., LTD., Tokyo, JP;
Abstract
Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (), comprising: a cathode chamber () in which a workpiece () is to be placed; an anode chamber (); an anode () placed in the anode chamber; an electrically conductive diaphragm () placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank () for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank () for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit () that provides an electric current to flow between the workpiece and the anode.