The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2020
Filed:
Sep. 29, 2016
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Chikao Ikenaga, Tokyo, JP;
Yo Shimazaki, Tokyo, JP;
Kentarou Seki, Tokyo, JP;
Hiroki Furushou, Tokyo, JP;
Chiaki Hatsuta, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Shinjuku-Ku, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/04 (2006.01); H01L 51/50 (2006.01); C25D 1/08 (2006.01); C23F 1/02 (2006.01); G03F 7/00 (2006.01); H05B 33/10 (2006.01); B23K 26/073 (2006.01);
U.S. Cl.
CPC ...
C23C 14/042 (2013.01); C23C 14/04 (2013.01); C23F 1/02 (2013.01); C25D 1/08 (2013.01); G03F 7/0015 (2013.01); H01L 51/50 (2013.01); H05B 33/10 (2013.01); B23K 26/073 (2013.01);
Abstract
A deposition mask includes a mask body and a through-hole provided in the mask body and through which a deposition material passes when the deposition material is deposited on a deposition target substrate. The mask body satisfies y≥950 and y≥23x−1280 when an indentation elastic modulus is x (GPa) and a 0.2% yield strength is y (MPa). When the mask body satisifies these inequalities, the generation of recesses during ultrasonic cleaning of the mask can be suppressed.