The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Jan. 16, 2015
Applicant:

Dai Nippon Printing Co., Ltd., Tokyo-To, JP;

Inventors:

Kentaro Hoshi, Tokyo-To, JP;

Yuto Enomoto, Tokyo-To, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); B32B 37/06 (2013.01); B32B 37/12 (2013.01); B32B 38/10 (2013.01); B32B 2305/72 (2013.01); C09J 2400/286 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2483/00 (2013.01);
Abstract

An adhesive composition that enables adhesion between metals, between a metal and an organic material, and between an organic material and an organic material, have at the same time an excellent storage stability, and are capable of maintaining an excellent adhesive strength even in a high temperature hydrothermal environment, is provided. The adhesive composition according to the present invention comprises an epoxy resin, an epoxy modified silicone resin, an acrylic resin, and a curing agent, the above-mentioned epoxy resin comprising a bisphenol bifunctional epoxy resin and an epoxy resin with trifunctionality or higher functionality, and the above acrylic resin comprising a binary copolymer of methyl methacrylate-butyl acrylate-methyl methacrylate or a modified product thereof.


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