The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Apr. 08, 2016
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Robert Alan Bellman, Painted Post, NY (US);

Dana Craig Bookbinder, Corning, NY (US);

Theresa Chang, Painted Post, NY (US);

Jeffrey John Domey, Elmira, NY (US);

Robert George Manley, Vestal, NY (US);

Prantik Mazumder, Ithaca, NY (US);

Alan Thomas Stephens, II, Beaver Dams, NY (US);

Assignee:

CORNING INCORPORATED, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); C03B 25/02 (2006.01); B32B 17/06 (2006.01); C03B 40/00 (2006.01); C03B 35/14 (2006.01); C03C 1/00 (2006.01); B05D 1/00 (2006.01); C03C 17/32 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
C03B 25/025 (2013.01); B05D 1/60 (2013.01); B32B 7/06 (2013.01); B32B 17/06 (2013.01); C03B 35/14 (2013.01); C03B 40/005 (2013.01); C03C 1/00 (2013.01); C03C 17/328 (2013.01); G02F 2001/133302 (2013.01);
Abstract

Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.


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