The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Sep. 07, 2018
Applicant:

Seiji Kagawa, Koshigaya, JP;

Inventor:

Seiji Kagawa, Koshigaya, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/16 (2006.01); C01B 32/05 (2017.01); B32B 27/28 (2006.01); B32B 9/00 (2006.01); B29D 7/01 (2006.01); B32B 27/06 (2006.01); B32B 9/04 (2006.01); B32B 5/30 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); C09K 5/14 (2006.01); B32B 3/04 (2006.01); B32B 27/34 (2006.01); B32B 27/32 (2006.01); B32B 27/14 (2006.01); H01L 23/373 (2006.01); B32B 27/18 (2006.01); B32B 27/24 (2006.01); B32B 38/10 (2006.01); B32B 37/22 (2006.01); B32B 37/02 (2006.01); B32B 37/10 (2006.01); B32B 37/06 (2006.01); B32B 37/24 (2006.01);
U.S. Cl.
CPC ...
B32B 5/16 (2013.01); B29D 7/01 (2013.01); B32B 3/04 (2013.01); B32B 5/30 (2013.01); B32B 9/007 (2013.01); B32B 9/045 (2013.01); B32B 9/048 (2013.01); B32B 27/06 (2013.01); B32B 27/14 (2013.01); B32B 27/18 (2013.01); B32B 27/281 (2013.01); B32B 27/285 (2013.01); B32B 27/286 (2013.01); B32B 27/288 (2013.01); B32B 27/302 (2013.01); B32B 27/304 (2013.01); B32B 27/306 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/365 (2013.01); C01B 32/05 (2017.08); C09K 5/14 (2013.01); H01L 23/3737 (2013.01); B32B 37/02 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); B32B 37/22 (2013.01); B32B 38/10 (2013.01); B32B 2037/243 (2013.01); B32B 2250/40 (2013.01); B32B 2260/025 (2013.01); B32B 2260/046 (2013.01); B32B 2264/00 (2013.01); B32B 2264/108 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/416 (2013.01); B32B 2307/72 (2013.01); B32B 2309/02 (2013.01); B32B 2457/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A heat-dissipating film comprising a heat-conductive layer obtained by burning a mixture layer of flaky carbon and a binder resin to carbonize or burn off the binder resin, and plastic films covering the heat-conductive layer, the heat-conductive layer having a density of 1.9 g/cmor more and thermal conductivity of 450 W/mK or more, is produced by (1) sandwiching a mixture layer of flaky carbon and a binder resin with a pair of first plastic films to form a laminated film; (2) heat-pressing the laminated film to densify the mixture layer; (3) burning the mixture layer to carbonize the binder resin in the mixture layer; (4) pressing the resultant burnt layer to form the heat-conductive layer; and (5) sealing the heat-conductive layer with second plastic films.


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