The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10537939 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 21, 2020

Filed:

Jan. 21, 2015
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Chi Hao Chang, Taipei, TW;

Chien-Ting Lin, Taipei, TW;

Kuan-Ting Wu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/36 (2006.01); B22F 3/11 (2006.01); B22F 3/105 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); H05K 5/03 (2006.01); H05K 5/04 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1115 (2013.01); B22F 3/1055 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 5/03 (2013.01); H05K 5/04 (2013.01); B22F 2003/1058 (2013.01);
Abstract

One example provides a method of manufacturing. The method comprises printing multiple layers comprising a metal material by an additive manufacturing technique, wherein each of the multiple layers comprises an array of cavities each having a cross-section of a polygon; and assembling at least two of the multiple layers to form an article having an array of three-dimensional hollow cells collectively having a honeycomb structure.


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Chang, Chi. (2020). Method of manufacturing a honeycomb structure for an electronic device (U.S. Patent No. 10537939). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10537939

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