The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Aug. 17, 2017
Applicant:

Auras Technology Co., Ltd., New Taipei, TW;

Inventors:

Mu-Shu Fan, New Taipei, TW;

Chien-Yu Chen, New Taipei, TW;

Assignee:

AURAS TECHNOLOGY CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01); F04D 17/16 (2006.01); F04D 29/52 (2006.01); F04D 29/58 (2006.01); F04D 19/00 (2006.01); F04D 17/02 (2006.01); F04D 25/06 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20272 (2013.01); F04D 17/025 (2013.01); F04D 17/16 (2013.01); F04D 19/002 (2013.01); F04D 25/0613 (2013.01); F04D 29/526 (2013.01); F04D 29/582 (2013.01); G06F 1/20 (2013.01); H05K 7/20154 (2013.01); H05K 7/20218 (2013.01); H05K 7/20263 (2013.01); H01L 23/473 (2013.01);
Abstract

An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.


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