The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Dec. 31, 2015
Applicant:

Shenzhen Royole Technologies Co. Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yijun Shi, Guangdong, CN;

Qi Lin, Guangdong, CN;

Jianlei Zhu, Guangdong, CN;

Xin Chen, Guangdong, CN;

Ji Wang, Guangdong, CN;

Assignee:

SHENZHEN ROYOLE TECHNOLOGIES CO., LTD., Shenzhen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04M 1/02 (2006.01); H04M 1/04 (2006.01); H04M 1/22 (2006.01); G06F 3/041 (2006.01); H02J 7/00 (2006.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
H04M 1/0277 (2013.01); H04M 1/0262 (2013.01); H04M 1/04 (2013.01); H04M 1/22 (2013.01); G06F 3/041 (2013.01); G06F 2203/04102 (2013.01); H02J 7/0044 (2013.01); H02J 7/025 (2013.01); H04M 1/0279 (2013.01); H04M 2250/02 (2013.01);
Abstract

A terminal device includes a main body and a flexible touch panel. The main body includes a substrate, an earphone assembly, and a microphone assembly. The earphone assembly and the microphone assembly are respectively set on two opposite ends of the substrate. The flexible touch panel is on the substrate. The flexible touch panel is between the earphone assembly and the microphone assembly. The flexible touch panel is set on the substrate, to realize the touch and control function during using by a user. The whole substrate is thin, and the earphone assembly and the microphone assembly are set respectively on both ends of the substrate, communication may be realized simultaneously, the whole structural compactness of the terminal device may also be improved, and the whole thickness of the terminal device may be reduced.


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