The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Aug. 01, 2017
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Tetsuya Matsuda, Chiyoda-ku, JP;

Shigeto Fujita, Chiyoda-ku, JP;

Tetsuo Motomiya, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H02M 1/34 (2007.01); H02M 7/537 (2006.01); H05K 7/02 (2006.01); H05K 7/04 (2006.01);
U.S. Cl.
CPC ...
H02M 7/003 (2013.01); H02M 1/34 (2013.01); H02M 7/537 (2013.01); H05K 7/023 (2013.01); H05K 7/04 (2013.01); H02M 2001/346 (2013.01);
Abstract

There has been a problem that a chip or a power module is broken by a repulsive electromagnetic force between positive and negative bus bars and an arc is generated, so that the failure is escalated. Therefore, positive and negative bus bars connecting two devices are configured so as to form a one-turn-loop current path, thereby suppressing a repulsive electromagnetic force occurring between the bus bars and decreasing a possibility of occurrence of an arc at the power module.


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